MFmATX-Q670
Industrial Micro ATX Embedded Motherboard with Intel 12/13/14th Q670 chipset LGA1700 i3/i5/i7/i9 processor
Data sheet (PDF)CPU | Intel 12/13/14th LGA1700 Socket Processor Support Max CPU TDP: 8 + 8 core 125W |
Chipset | Intel Q670 |
System Memory | 4 x DDR4-3200MHz Non-ECC U-DIMM, up to 128GB |
BIOS | AMI |
COM | 4 x RS-232, 1 x RS-232/485/422, 1 x RS-232/485 (Internal) |
USB | 8 x USB 3.0 (Internal 2 x USB 3.0) 2 x USB 2.0 (Internal 4 x USB 2.0) |
Ethernet | 1 x Intel 2.5GbE, 2 x Intel Gigabit Ethernet |
Display | 1 x DVI-D 1 x DP 1 x VGA |
Digital I/O | Programmable support 4 in/4 out |
Audio | Line-Out + MIC + Line-In |
Storage | 4 x SATA 3.0 1 x M.2 Key-M (PCIe x4 Gen 4 NVMe/SATA SSD 2242/2280 Auto Detect) |
Expansion | 1 x PCI-E x16 Slot 2 x PCI-E x4 Slot 1 x PCI Slot 1 x M.2 (Key-E, 2230, PCIe + USB 2.0, support Wifi + BT) |
Others | 1 x SMBUS Wafer, 1 x Front Panel Header, 2 x System FAN Wafer, 1 x CPU Fan Wafer, 1 x AT or ATX Select Jumper, 1 x Power monitor wafer |
Battery | - |
Power Requirements | ATX Standard (24P + 8P + 4P) 1 x ATX 4P CPU Power Input Connector 1 x ATX 8P CPU Power Input Connector 1 x ATX 24P Power Input Connector |
Watchdog Timer | 1 - 255 steps by software program |
Hardware Monitoring | - |
Operating Temperature | 0°C to +60°C (+32°F to +140°F) |
Relative Humidity | 10% to 95% relative humidity, non-condensing |
Dimensions | 244 x 244 mm |
Board Thickness | - |
Certifications | CE, FCC |